JF

Jumpei Fujikata

EB Ebara: 6 patents #2 of 147Top 2%
Overall (2021): #22,362 of 548,734Top 5%
6
Patents 2021

Issued Patents 2021

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
11047063 Plating apparatus and plating method Masashi Shimoyama, Yoichi Nakagawa, Yoshitaka Mukaiyama, Yoshio Minami 2021-06-29
10954603 Substrate holder, plating apparatus, plating method, and electric contact 2021-03-23
10946351 Paddle, plating apparatus equipped with the paddle, and plating method Yasuyuki Masuda, Masashi Shimoyama, Yohei Wakuda, Shao Hua Chang 2021-03-16
10914019 Plating apparatus and plating method Shao Hua Chang, Yasuyuki Masuda, Masashi Shimoyama, Tsutomu Nakada 2021-02-09
10914020 Wave absorbing member attachable to paddle and plating apparatus including wave absorbing member Shao Hua Chang 2021-02-09
10910334 Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium Takahisa Okuzono, Masaki Tomita 2021-02-02