Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910334 | Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium | Masaki Tomita, Jumpei Fujikata | 2021-02-02 |