Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094459 | Substrates with integrated three dimensional inductors with via columns | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2021-08-17 |
| 10905007 | Contact pads for electronic substrates and related methods | Thomas Scott Morris, David Jandzinski | 2021-01-26 |