Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121069 | Semiconductor package including capping pad having crystal grain of different size | Jaehoon Choi, Doohwan Lee, Byungho Kim | 2021-09-14 |
| 11049815 | Semiconductor package | Taewook Kim, Byungho Kim, Sangseok HONG, Jaehoon Choi, Seongjin Shin | 2021-06-29 |