Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121069 | Semiconductor package including capping pad having crystal grain of different size | Doohwan Lee, Byungho Kim, Jooyoung Choi | 2021-09-14 |
| 11049815 | Semiconductor package | Jooyoung Choi, Taewook Kim, Byungho Kim, Sangseok HONG, Seongjin Shin | 2021-06-29 |