Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145626 | Semiconductor package | Ji Hwan Hwang, Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee | 2021-10-12 |
| 11088038 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim | 2021-08-10 |
| 11056432 | Semiconductor package | Hyuek Jae Lee, Ji Hoon Kim, Tae Hun Kim, Ji Hwan Hwang | 2021-07-06 |
| 10910346 | Semiconductor package | Ji Hoon Kim | 2021-02-02 |
| 10886255 | Die stack structure, semiconductor package having the same and method of manufacturing the same | Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee, Ji Hwan Hwang | 2021-01-05 |