Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158594 | Semiconductor packages having improved reliability in bonds between connection conductors and pads | Hyuekjae Lee, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2021-10-26 |
JH
Jiseok Hong
Overall (2021): #406,072 of 548,734Top 75%
1
Patents 2021