Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158594 | Semiconductor packages having improved reliability in bonds between connection conductors and pads | Jiseok Hong, Hyuekjae Lee, Jihwan Hwang, Taehun Kim | 2021-10-26 |
JH
Jongpa HONG
Overall (2021): #397,738 of 548,734Top 75%
1
Patents 2021