Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139229 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Owen R. Fay | 2021-10-05 |
JM
Jack E. Murray
Overall (2021): #416,697 of 548,734Top 80%
1
Patents 2021