Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145581 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | Darrell D. Truhitte | 2021-10-12 |
| 11049843 | Semiconductor packages | Phillip Celaya, Robert L. Marquis, Darrell D. Truhitte | 2021-06-29 |