Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107783 | Wafer-level package including under bump metal layer | Yeo-Hoon Yoon | 2021-08-31 |
HJ
Hyung-Sun Jang
Overall (2021): #427,345 of 548,734Top 80%
1
Patents 2021