Issued Patents 2021
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205607 | Semiconductor structure and method of manufacturing thereof | Chiang-Lin Shih, Ching-Hung Chang, Pei-Jhen Wu | 2021-12-21 |
| 11189562 | Interconnection structure having increased conductive features and method of manufacturing the same | Chen-Liang Chu | 2021-11-30 |
| 11183502 | Memory cell and Method for reading out data therefrom | — | 2021-11-23 |
| 11171087 | Semiconductor structure and controlling method thereof | — | 2021-11-09 |
| 11121062 | Semiconductor device and method for manufacturing the same | — | 2021-09-14 |
| 11107730 | Method of manufacturing semiconductor device with anti-fuse structures | — | 2021-08-31 |
| 11063003 | Semiconductor device with diced semiconductor chips and method for manufacturing the same | Ching-Hung Chang | 2021-07-13 |
| 11031462 | Semiconductor structure with improved guard ring structure | — | 2021-06-08 |
| 11024560 | Semiconductor structure and manufacturing method thereof | — | 2021-06-01 |
| 11018103 | Integrated circuit structure | Chien-Chung Wang | 2021-05-25 |
| 11011468 | Semiconductor structure and method for manufacturing the same | — | 2021-05-18 |
| 10985134 | Method and system of manufacturing stacked wafers | — | 2021-04-20 |
| 10910345 | Semiconductor device with stacked die device | Chiang-Lin Shih, Pei-Jhen Wu, Ching-Hung Chang | 2021-02-02 |
| 10896848 | Method of manufacturing a semiconductor device | — | 2021-01-19 |
| 10886236 | Interconnect structure | Ting-Cih KANG | 2021-01-05 |