Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957592 | Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate | Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Masaaki Asano | 2021-03-23 |