Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11153471 | Through-hole electrode substrate | Yoshiaki Tsuruoka, Shinji Maekawa | 2021-10-19 |
| 10957592 | Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate | Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Hiroshi Mawatari | 2021-03-23 |