Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101566 | Method for fabricating electronic package | Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin, Kuo-Hua Yu | 2021-08-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101566 | Method for fabricating electronic package | Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin, Kuo-Hua Yu | 2021-08-24 |