Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189537 | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit | Khalil Hosseini, Joachim Mahler | 2021-11-30 |
| 11189542 | Method for fabricating an electronic module via compression molding | Dae Kuen Park | 2021-11-30 |
| 11049790 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Manfred Mengel | 2021-06-29 |
| 11040872 | Semiconductor module | Claus Waechter, Bernd Goller, Michael Ledutke, Dominic Maier | 2021-06-22 |
| 10916515 | Systems and methods using an RF circuit on isolating material | Carsten Ahrens, Anton Steltenpohl, Anneliese Mueller | 2021-02-09 |