Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971208 | Semiconductor device having interconnection in package and method for manufacturing the same | Jaehyung Lee, Jungsik Kim, Youngdae Lee, Sungmin Yim, Kwangil Park +1 more | 2021-04-06 |
DK
Duyeul Kim
Overall (2021): #469,090 of 548,734Top 90%
1
Patents 2021