Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971208 | Semiconductor device having interconnection in package and method for manufacturing the same | Jaehyung Lee, Jungsik Kim, Youngdae Lee, Duyeul Kim, Kwangil Park +1 more | 2021-04-06 |
SY
Sungmin Yim
Overall (2021): #245,112 of 548,734Top 45%
1
Patents 2021