Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043441 | Fan-out semiconductor package | Tae-Je Cho | 2021-06-22 |
| 11011482 | Fan-out semiconductor package | Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh | 2021-05-18 |
| 11011485 | Semiconductor package | Jae Hoon Choi, Joo Young Choi, Sung Ho Han, Byung Ho Kim | 2021-05-18 |
| 10903170 | Substrate having embedded interconnect structure | Yong Hoon Kim, Tae-Je Cho, Jin Won Lee | 2021-01-26 |
| 10892227 | Fan-out semiconductor package | Hyoung Joon Kim | 2021-01-12 |
| 10886230 | Fan-out semiconductor package | Hyoung Joon Kim | 2021-01-05 |
| 10887995 | Method for manufacturing a printed circuit board including an embedded electronic component | Seung Eun Lee, Yee Na Shin, Yul Kyo Chung | 2021-01-05 |