Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107769 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim | 2021-08-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107769 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim | 2021-08-31 |