Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195145 | Blockchain ledgers of material spectral signatures for supply chain integrity management | Nicholas C. M. Fuller, Prabhakar Kudva | 2021-12-07 |
| 11168234 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Sampath Purushothaman, Mary E. Rothwell, Willi Volksen +1 more | 2021-11-09 |