Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957631 | Angled die pad of a leadframe for a molded integrated circuit package | Yuh-Harng Chien, Fu-Kang Lee, Chia-Yu Chang | 2021-03-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957631 | Angled die pad of a leadframe for a molded integrated circuit package | Yuh-Harng Chien, Fu-Kang Lee, Chia-Yu Chang | 2021-03-23 |