Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081428 | Electronic device with three dimensional thermal pad | Stanley Shihyao Chou, Steven Kummerl, Bo-Hsun Pan, Pi-Chiang Huang, Frank Yu +1 more | 2021-08-03 |
| 11081429 | Finger pad leadframe | Jason Chien, J K Ho | 2021-08-03 |
| 10957631 | Angled die pad of a leadframe for a molded integrated circuit package | Chung Ming Cheng, Fu-Kang Lee, Chia-Yu Chang | 2021-03-23 |