Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201066 | Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package | Robert Francis Darveaux, Yi-Ling Liu | 2021-12-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201066 | Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package | Robert Francis Darveaux, Yi-Ling Liu | 2021-12-14 |