Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201066 | Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package | Robert Francis Darveaux, Bruce J. Freyman | 2021-12-14 |
| 11195841 | Integrated circuit and method for manufacturing the same | Chi-Chung Jen, Yu-Chu Lin, Cheng Wang | 2021-12-07 |