Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171066 | Semiconductor panels, semiconductor packages, and methods for manufacturing thereof | Thorsten Meyer | 2021-11-09 |
| 11056458 | Package comprising chip contact element of two different electrically conductive materials | Angela Kessler | 2021-07-06 |