Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211258 | Method of addressing dissimilar etch rates | — | 2021-12-28 |
| 11174151 | Integrated MEMS cavity seal | — | 2021-11-16 |
| 10941033 | 3D stack configuration for 6-axis motion sensor | Dongyang Kang, Bongsang Kim, Bei Zhu | 2021-03-09 |