Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11077462 | Reliable deposition of thin parylene | Yu-Chong Tai, Wei Wang | 2021-08-03 |
| 11040871 | Device comprising a micro-electro-mechanical system substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor substrate | Jongwoo Shin, Houri Johari-Galle, Bongsang Kim, Joseph Seeger | 2021-06-22 |
| 10988372 | MEMS device with reduced electric charge, cavity volume and stiction | — | 2021-04-27 |
| 10941033 | 3D stack configuration for 6-axis motion sensor | Bongsang Kim, Bei Zhu, Ian Flader | 2021-03-09 |
| 10906802 | Actuator layer patterning with topography | Daesung Lee, Chienlu Chang, Bongsang Kim, Alan Cuthbertson | 2021-02-02 |