Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121073 | Through plate interconnect for a vertical MIM capacitor | Travis W. Lajoie, Abhishek A. Sharma, Juan G. Alzate-Vinasco, Chieh-Jen Ku, Allen B. Gardiner +6 more | 2021-09-14 |
| 11107658 | Fill pattern to enhance e-beam process margin | Shakul Tandon, Mark C. Phillips, John A. Swanson | 2021-08-31 |