Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11169951 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2021-11-09 |
| 11100029 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2021-08-24 |
| 11075648 | Seemingly monolithic interface between separate integrated circuit die | David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones | 2021-07-27 |
| 10936531 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2021-03-02 |
| 10884964 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2021-01-05 |