Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11169951 | Distributed multi-die protocol application interface | Keith Duwel, Cora Lynn Mau | 2021-11-09 |
| 11121715 | Coarse-grain programmable routing network for logic devices | Sean R. Atsatt | 2021-09-14 |
| 11100029 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Keith Duwel, Jakob Raymond Jones | 2021-08-24 |
| 10936531 | Distributed multi-die protocol application interface | Keith Duwel, Cora Lynn Mau | 2021-03-02 |