Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164975 | Semiconductor device having a necked semiconductor body and method of forming semiconductor bodies of varying width | — | 2021-11-02 |
| 11121073 | Through plate interconnect for a vertical MIM capacitor | Travis W. Lajoie, Abhishek A. Sharma, Juan G. Alzate-Vinasco, Chieh-Jen Ku, Shem Ogadhoh +6 more | 2021-09-14 |