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Co-packaged light engine chiplets on switch substrate |
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Method for co-packaging light engine chiplets on switch substrate |
Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye |
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| D933617 |
Heat sink cover |
Chris Togami, Gary Sasser, Brian Taylor |
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| 11153013 |
Histogram based optimization for optical modulation |
Todd Rope, Hari Shankar |
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| 11109515 |
Heatsink for co-packaged optical switch rack package |
Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye |
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| 11002913 |
Optical dispersion compensator on silicon |
Xiaoguang Tu, Masaki Kato |
2021-05-11 |
| 10989937 |
Method and system for integrated differential electro-absorption modulator device |
— |
2021-04-27 |
| 10951003 |
Light source for integrated silicon photonics |
Xiaoguang He |
2021-03-16 |
| 10951343 |
Optical module |
— |
2021-03-16 |
| 10942323 |
Apparatus and method for thermal dissipation of photonic transceiving module |
Chris Togami, Gary Sasser, Brian Taylor |
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| 10924269 |
Compact optical module integrated for communicating cryptocurrency transaction |
Liang Ding, Roberto Coccioli |
2021-02-16 |
| 10908370 |
Package structure for photonic transceiving device |
Peng-Chih Li, Masaki Kato |
2021-02-02 |
| 10892598 |
Small form factor transmitting device |
Peng-Chih Li, Pi-Cheng Law |
2021-01-12 |
| 10892830 |
Integrated compact in-package light engine |
Ding Liang, Mark Patterson, Roberto Coccioli |
2021-01-12 |
