Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018072 | Semiconductor package having overlapping electrically conductive regions and method for producing the same | Juergen Hoegerl, Ordwin Haase | 2021-05-25 |
| 10985110 | Semiconductor package having an electromagnetic shielding structure and method for producing the same | Juergen Hoegerl, Ordwin Haase | 2021-04-20 |