Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018072 | Semiconductor package having overlapping electrically conductive regions and method for producing the same | Ordwin Haase, Tobias Kist | 2021-05-25 |
| 11004764 | Semiconductor package having symmetrically arranged power terminals and method for producing the same | Tao Hong, Tino Karczewski, Matthias Lassmann, Christian Schweikert | 2021-05-11 |
| 10985110 | Semiconductor package having an electromagnetic shielding structure and method for producing the same | Ordwin Haase, Tobias Kist | 2021-04-20 |
| 10964642 | Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane | Andre Arens, Holger Torwesten | 2021-03-30 |