Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015018 | Resin composition and method for manufacturing thermally conductive material | Min Wang, Hsiang-Yen TSAO, Kuo-Chan Chiou | 2021-05-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015018 | Resin composition and method for manufacturing thermally conductive material | Min Wang, Hsiang-Yen TSAO, Kuo-Chan Chiou | 2021-05-25 |