Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015018 | Resin composition and method for manufacturing thermally conductive material | Yen-Chun Liu, Min Wang, Hsiang-Yen TSAO | 2021-05-25 |
| 11016385 | Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition | Yi Yang, Shou-Yi Ho | 2021-05-25 |
| 10954329 | Modified copolymer, method for preparing the same, and method for preparing paste | Shou-Yi Ho | 2021-03-23 |
| 10894853 | Furan-modified compound and oligomer | Kuei-Yi Chuang, Feng-Po Tseng | 2021-01-19 |