Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11076483 | Direct bonded copper ceramic substrate | Chien-Chiang Hsu, Chien-Chung Hsu, Kuo-Chuang Chiu | 2021-07-27 |
| 10974994 | Core-shell composite material and method for manufacturing the same | Sheng-Min Yu, Chien-Chung Hsu, Ming-Hui Chang | 2021-04-13 |