Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11076483 | Direct bonded copper ceramic substrate | Kai-Hsiang Chuang, Chien-Chung Hsu, Kuo-Chuang Chiu | 2021-07-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11076483 | Direct bonded copper ceramic substrate | Kai-Hsiang Chuang, Chien-Chung Hsu, Kuo-Chuang Chiu | 2021-07-27 |