Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10978452 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, David S. Collins | 2021-04-13 | $3,936,000 |