Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978452 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | David S. Collins, Steven H. Voldman | 2021-04-13 |
PC
Phillip F. Chapman
Overall (2021): #302,238 of 548,734Top 60%
1
Patents 2021