Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11085837 | Method for assembling force sensor, involves applying sense die adhesive to place, where sense die material is removed | Jason Dennis Patch, Jim Machir, Richard Wade, Jim Cook | 2021-08-10 | $40,913,000 |