Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145565 | Method of fabricating a chip package module with improve heat dissipation effect | Hsi-Ying Yuan, Tung-Chuan Wang, Chun Yuan Hou, Tzu-kuei Wen | 2021-10-12 |
| 10980935 | Enema device and method of using the same | — | 2021-04-20 |