Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145565 | Method of fabricating a chip package module with improve heat dissipation effect | Hsi-Ying Yuan, Chun Yuan Hou, Ping-Lung Wang, Tzu-kuei Wen | 2021-10-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145565 | Method of fabricating a chip package module with improve heat dissipation effect | Hsi-Ying Yuan, Chun Yuan Hou, Ping-Lung Wang, Tzu-kuei Wen | 2021-10-12 |