Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930592 | Wafer level fan-out application specific integrated circuit bridge memory stack | Nam Hoon Kim, Teckgyu Kang | 2021-02-23 |
| 10896873 | Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications | Nam Hoon Kim, Teckgyu Kang | 2021-01-19 |