Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964625 | Device and method for direct liquid cooling via metal channels | Padam Jain, Yuan Li, Madhusudan K. Iyengar | 2021-03-30 |
| 10930592 | Wafer level fan-out application specific integrated circuit bridge memory stack | Nam Hoon Kim, Woon-Seong Kwon | 2021-02-23 |
| 10896873 | Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications | Woon-Seong Kwon, Nam Hoon Kim | 2021-01-19 |