Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171036 | Preventing dielectric void over trench isolation region | Wei Hong, Chun Yu Wong, Halting Wang, Liu Jiang | 2021-11-09 |
| 11093232 | Microservice update system | Marc Marcel René Maréchal | 2021-08-17 |
| 10910276 | STI structure with liner along lower portion of longitudinal sides of active region, and related FET and method | Xinyuan Dou, Chun Yu Wong, Hongliang Shen, Baofu Zhu | 2021-02-02 |