Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171036 | Preventing dielectric void over trench isolation region | Yongjun Shi, Wei Hong, Halting Wang, Liu Jiang | 2021-11-09 |
| 11018221 | Air gap regions of a semiconductor device | Haiting Wang, Yong Shi, Xiaoming Yang, Liu Jiang | 2021-05-25 |
| 10910276 | STI structure with liner along lower portion of longitudinal sides of active region, and related FET and method | Yongjun Shi, Xinyuan Dou, Hongliang Shen, Baofu Zhu | 2021-02-02 |