Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114542 | Semiconductor device with reduced gate height budget | Hui Zang | 2021-09-07 |
| 10964599 | Multi-step insulator formation in trenches to avoid seams in insulators | Asli Sirman, Jiehui Shu, Chih-Chiang Chang, Huy Cao, Jinping Liu | 2021-03-30 |
| 10930549 | Cap structure | Jinsheng Gao, Daniel Jaeger, Chih-Chiang Chang, Michael V. Aquilino, Patrick Carpenter +3 more | 2021-02-23 |
| 10923388 | Gap fill void and connection structures | Yuping Ren, Paul Ackmann, Guoxiang Ning | 2021-02-16 |