Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11064613 | Electronics encapsulation through hotmelt lamination | Weifeng Liu, Dongkai Shangguan | 2021-07-13 |
| 10993635 | Integrating biosensor to compression shirt textile and interconnect method | Weifeng Liu, Dason Cheung, Jie Lian, Christian Biederman, Anwar Mohammed +1 more | 2021-05-04 |
| 10999926 | Stress relief encapsulation for flexible hybrid electronics | Weifeng Liu, Dongkai Shangguan | 2021-05-04 |